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Thermal Interface Resistance

Excerpt

It is common practice to use brackets, heat sinks, and circuit boards for mounting components that are to be cooled by conduction. The primary heat transfer mode inside a component is also heat conduction. Cooling by conduction often requires the transfer of heat across various materials and interfaces that may be laminated, bolted, riveted, clamped, or bonded together. A high temperature gradient may occur if a large amount of heat is transferred across these interfaces.

9.1Factors Affecting Thermal Contact Resistance
9.2Joint Thermal Contact Resistance
9.3Methods of Reducing Thermal Contact Resistance
9.4Solder and Epoxy Joints
9.5Practical Design Data
References

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