0
Chapter 3
Components and Materials: The Sum of the Parts Is Sometimes Just a Big Hole

Excerpt

When university labs investigate heat transfer in electronic assemblies, they hardly ever use printed circuit boards and electronic components to represent printed circuit boards and electronic components. Boards are represented by uniform thermal insulators like balsa wood, and components are represented by blocks of aluminum. Why? Quite understandably, the researchers need to simplify the assemblies to make them easier to understand. They are looking for fluid flow and heat transfer phenomena, and they don't want a lot of the details of real electronic components to complicate the picture.

Too bad we can't do the same thing. It would be a lot easier to figure out component temperatures if they were all uniformly sized aluminum blocks. And conduction within the printed circuit board would be a lot easier to calculate if we didn't have all those messy copper traces mixed in with the dielectric.

  • Chapter 3.1 Not Working Within the Limits
  • Chapter 3.2 Don't Blow It When Sizing a Fuse
  • Chapter 3.3 When It's Hot, They All Go in the Pool
  • Chapter 3.4 Bypass Capacitors?
  • Chapter 3.5 A Baffling Temperature Rise
  • Chapter 3.6 24K Gold Heat Sinks: Worth Their Weight in Aluminum
  • Chapter 3.7 Improving the Weakest Player
  • Chapter 3.8 Getting Lost in the Cracks

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In