Simulation and Optimization of Injection Process for LCD Cover


C-Mold software was applied to the analysis of injection molding of the LCD cover so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, problems have been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.

  • Abstract
  • Key Words
  • 1 Introduction
  • 2 Original Design
  • 3 Revised Design
  • 4. Summaries
  • 5. Acknowledgment
  • References

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In