0
Study on Heat Emission Numerical Simulation and Layout Optimization Concerning Components of Electronic Equipment

Excerpt

In this paper, the lumped parameter mathematical model is established based on the heat transmission process of electronic component inside the sealed electronic components. The heat analysis software SINDA/FLUINT is used to make comparison of the layout of electronic components of the same quantities and conduct the analysis on optimized numerical simulation to design parameters in order to obtain the most optimized design plan concerning component. The heat equation is used to establish heat balance equations and calculate the temperature of node. In addition, the computer-aided design is utilized to accomplish a reasonable, economical, and feasible heat design to meet the indicated temperature control of electronic equipment.

  • Abstract
  • Keywords
  • Introduction
  • Nomenclature
  • Structural Modeling and Model Simplification
  • Establishment of Mathematical Model
  • Meshing and Process of Numerical Solution
  • Determination of Convective Heat Transfer Coefficient Inside and Outside the Packaging Shell
  • Comparative Analysis on Temperature Distribution of Overall Electronic Components Layout
  • Conclusion
  • References

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In