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Research on Bonding Technology Parameter Optimize of NiPdAu PCB Based on MINITAB

Excerpt

In order to improving reliability and economy of down-lead bonding of MEMS packaging , NiPdAu PCB is leaded in ,because palladium is joined in protecting involucra , bonding technology parameter must change . In this paper, robust parameter design method of MINITAB software is used and optimize bonding technology parameter of new type NiPdAu involucra has been discovered , according to optimize results , mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology , not only increasing reliability of products , but also reducing cost of raw materials and obtaining well economy benefit.

  • Abstract
  • Key Words
  • I. Introduction
  • II. Factors of Affect Spun Gold Bonding Quality
  • III. Using Robust Parameter Design Optimize Bondin Technology Parameter
  • IV. Validate Experiment
  • V. Conclusion
  • Acknowledgements
  • References
Topics: Bonding

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