For the effective use of nanowires and nanotubes in their many possible applications in sensing, computation and memory, optoelectronics, and energy conversion, it is important to understand their thermal properties, which may differ considerably from bulk [1]. For example, there is good agreement between theory and experiments on Si nanowires showing that the classical size effect of phonon boundary scattering may reduce the thermal conductivity by up to several orders of magnitude for diameters of 40 nm and up [2, 3, 12, 13]. However, more experiments are needed at 20 nm and smaller diameters. There is also a need for experiments on the specific heat of single nanowires, which is intimately related to thermal conductivity by kinetic theory, and may be altered by quantum confinement effects. We have previously measured the specific heat of a pellet of TiO2 nanotubes of ∼3 nm wall thickness and found it similar to the bulk material at temperatures above ∼80 K [4]; however, questions remain about the possible interactions between adjacent tubes, which single-tube studies would resolve.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Thermal Conductivity and Specific Heat Measurements of Single Nanowires
Chris Dames,
Chris Dames
Massachusetts Institute of Technology, Cambridge, MA
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Gang Chen
Gang Chen
Massachusetts Institute of Technology, Cambridge, MA
Search for other works by this author on:
Chris Dames
Massachusetts Institute of Technology, Cambridge, MA
Gang Chen
Massachusetts Institute of Technology, Cambridge, MA
Paper No:
HT2005-72780, pp. 489-493; 5 pages
Published Online:
March 9, 2009
Citation
Dames, C, & Chen, G. "Thermal Conductivity and Specific Heat Measurements of Single Nanowires." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 489-493. ASME. https://doi.org/10.1115/HT2005-72780
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