International Electronic Packaging Technical Conference and Exhibition (InterPACK)
Focused on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies. (Content from 2003 to current year as becomes available/biennial)
Subject Category: Microtechnology and Nanotechnology (MNT)
Most Read Papers in InterPACK
Latest Proceedings in InterPACK
About ASME Conference Publications and Proceedings
ASME sponsors between 25-30 research conferences per year and publishes the papers presented as individual proceedings totaling approximately 7,000 papers. Conference topics encompass the entire spectrum of subject areas of interest to mechanical engineers and associated disciplines.
Exploring Conference Proceedings Content
Conference Proceedings are organized for your ease of use by Conference Series, Subject Categories, Proceedings Year, and Topic Collection.
Why Present and Publish With ASME?
More than 20,000 authors per year from across all continents share their research with colleagues throughout the world by presenting papers at ASME conferences. In addition to being a convener, ASME facilitates this process by ensuring the publication of quality content.
- Multidisciplinary Engineering (MD)
- Biomedical and Biotechnology Eng. (BEE)
- Design Engineering (DE)
- Materials and Manufacturing (MEE)
- Microtechnology and Nanotechnology (MN)
- Nuclear Engineering (NE)
- Power and Energy (PE)
- Pressure Technology (PTECH)