This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used was designated AP-3000 and was based on vinyltriacetoxysilane (VTAS), which had been properly hydrolyzed and advanced. Measurement of the interfacial adhesion was performed primarily using the modified Edge Liftoff Test It was found that, by applying the newly developed adhesion promoter, AP-3000, the interfacial energy of Photo-BCB to Al, Cu, Si, and SiN was significantly improved, often approaching the toughness of Photo-BCB, ca. 45 J/m2. The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) analyses of the delaminated surfaces of the Photo-BCB/Al structure revealed distinct differences in surface roughness and the chemical composition depending on whether or not adhesion promoter was used. Other parameters important for long term stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture absorption and good thermal stability, together with the given mechanical toughness and adhesion, allow the Photo-BCB to be widely usable for various microelectronic packaging applications, for up to 40 μm thick build in the case of silicon substrate. [S1043-7398(00)00701-5]
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March 2000
Technical Papers
On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
Jang-hi Im, Mem. ASME,
Jang-hi Im, Mem. ASME
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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Edward O. Shaffer, II,
Edward O. Shaffer, II
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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Theodore Stokich,, Jr.,
Theodore Stokich,, Jr.
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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Andrew Strandjord,
Andrew Strandjord
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
11
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Jack Hetzner,
Jack Hetzner
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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James Curphy,
James Curphy
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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Cheryl Karas,
Cheryl Karas
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
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Greg Meyers,
Greg Meyers
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
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David Hawn,
David Hawn
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
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Ashok Chakrabarti,
Ashok Chakrabarti
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
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Steve Froelicher
Steve Froelicher
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
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Jang-hi Im, Mem. ASME
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Edward O. Shaffer, II
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Theodore Stokich,, Jr.
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Andrew Strandjord
11
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Jack Hetzner
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
James Curphy
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Cheryl Karas
The Dow Chemical Company, Advanced Electronic Materials Laboratory, 1712 Building, Midland, MI 48674
Greg Meyers
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
David Hawn
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
Ashok Chakrabarti
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
Steve Froelicher
The Dow Chemical Company, Analytical Laboratory, 1897 Building, Midland, MI 48674
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD June 1, 1999; revision received October 20, 1999. Associate Technical Editor: B. Michel.
J. Electron. Packag. Mar 2000, 122(1): 28-33 (6 pages)
Published Online: October 20, 1999
Article history
Received:
June 1, 1999
Revised:
October 20, 1999
Citation
Im, J., Shaffer , E. O., II , Stokich, , T., Jr. , Strandjord, A., Hetzner , J., Curphy , J., Karas, C., Meyers , G., Hawn , D., Chakrabarti , A., and Froelicher, S. (October 20, 1999). "On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications ." ASME. J. Electron. Packag. March 2000; 122(1): 28–33. https://doi.org/10.1115/1.483128
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