A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]

Issue Section:
Technical Papers
Keywords:
packaging, fracture, bending, plastic packaging, delamination, design engineering, integrated circuit packaging
Topics:
Design, Electronic packages, Electronic packaging, Fracture (Materials), Fracture (Process), Fracture toughness, Stress, Testing, Geometry, Packaging, Delamination, Fracture mechanics
1.
Cao
,
H. C.
, and
Evans
,
A. G.
,
1989
, “
An Experimental Study of The Fracture Resistance of Bimaterial Interface
,”
Mech. Mater.
,
7
, pp.
295
–
304
.
2.
Charalambides
,
P. G.
, et al.,
1989
, “
A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
,”
ASME J. Appl. Mech.
,
56
, pp.
77
–
82
.
3.
Charalambides
,
P. G.
, et al.,
1990
, “
Development of a Test Method for Measuring the Mixed Mode Fracture Resistance of Bimaterial Interfaces
,”
Mech. Mater.
,
8
, pp.
269
–
283
.
4.
Wang
,
J.-S.
,
1995
, “
Interfacial Fracture Toughness of a Copper/Alumina System and The Effect of Loading Phase Angle
,”
Mech. Mater.
,
20
, pp.
251
–
259
.
5.
Wang
,
J.-S.
, and
Suo
,
Z.
,
1990
, “
Experimental Determination of Interfacial Toughness Curves Using Brazil-Nut-Sandwiches
,”
Acta Metall. Mater.
,
38
, No.
7
, pp.
1279
–
1290
.
6.
Yeung, T. S., et al., 1999, “Determination of Interfacial Fracture Properties for Electronics Materials,” to be published.
7.
Williams
,
M. L.
,
1959
, “
The Stresses Around a Fault or Crack in Dissimilar Media
,”
Bull. Seismol. Soc. Am.
,
49
, pp.
199
–
204
.
8.
Rice
,
J. R.
,
1988
, “
Elastic Fracture Mechanics Concepts for Interfacial Cracks
,”
ASME J. Appl. Mech.
,
55
, pp.
98
–
103
.
9.
Dundurs
,
J.
,
1969
, “
Edge-Bonded Dissimilar Orthogonal Elastic Wedges
,”
ASME J. Appl. Mech.
,
36
, pp.
650
–
652
.
10.
Hutchinson
,
J. W.
, and
Suo
,
Z.
,
1992
, “
Mixed Mode Cracking in Layered Materials
,”
Adv. Appl. Mech.
,
29
, pp.
63
–
191
.
11.
Matos
,
P. P. L.
, et al.,
1989
, “
A Method for Calculating Stress Intensities in Bimaterial Fracture
,”
Int. J. Fract.
,
40
, pp.
235
–
254
.
Copyright © 2000
 by ASME
You do not currently have access to this content.