The well-known, closed-form solution to thermal stresses of a die-substrate assembly is initially provided by Suhir in the mid-1980’s after Timoshenko [1] and Chen and Nelson [2]. It has been revised several times in its die attach (adhesive) peel solution by Suhir [3][4], and Mishkevich and Suhir [5]. However, there still exist some controversies and inconsistencies regarding die stresses, die attach shear and peel stresses, and warpage (deformation) of the assembly. In the study, Suhir’s derivation of the solution is closely examined in details, and the corrections to the solution are suggested and verified by comparing with the finite element results. It is shown that, unlike the original Suhir solution, the corrected one gives very good prediction of thermal stresses and deformations of die-substrate assembly. The limitation of the Suhir solution is also discussed in this study.

Issue Section:
Technical Papers
Keywords:
thermal stresses, electronics packaging, adhesion, deformation, microassembling
Topics:
Manufacturing, Stress, Thermal stresses, Warping, Finite element analysis, Shear (Mechanics), Deformation
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