One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy investigation was performed for tested assemblies. To elucidate the effects of ACF material properties and DNP on the thermal cycling reliability of ACF assembly, Weibull analysis for the lifetime estimation of ACF joint was performed, and compared with thermal deformations of ACF flip chip assembly investigated by moire´ interferometry. Results indicate that the properties of ACF have a significant role in the thermal deformation and reliability performance during thermal cycling testing. Therefore, optimized ACF properties can enhance ACF package reliability during thermal cycling regime.

Issue Section:
Research Papers
Keywords:
chip-on-board packaging, integrated circuit packaging, light interferometry, integrated circuit testing, integrated circuit reliability, integrated circuit interconnections, flip-chip devices, failure analysis, thermal analysis, delamination, adhesive bonding, anisotropic media, deformation, Weibull distribution, acoustic microscopy, Anisotropic Conductive Adhesive Joint, Moire´ Interferometry, Thermal Deformation, Thermal Cycling Reliability, Delamination
Topics:
Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation, Testing, Flip-chip assemblies, Flip-chip, Manufacturing
1.
Liu
,
J.
,
1995
, “
An Overview of Advances of Conductive Adhesive Joining Technology in Electronics Applications
,”
Mater. Technol.
,
10
(
11/12
), pp.
247
–
252
.
2.
Yim, M. J., Paik, K. W., Kim, Y. K., and Hwang, H. N., 1997, “A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film for LCD Packaging Application,” in Advances in Electronic Packaging, EEP, New York, 19(1), pp. 65–72.
3.
Yim, M. J., Jeon, Y. D., and Paik, K. W., 1999, “Electroless Ni Bumped Flip Chip Interconnections on an Organic Substrate Using Anisotropic Conductive Adhesives Films (ACAs/ACFs),” in Extended Abstract in IMAPS Workshop on Flip Chip Technology, IMAPS, Atlanta, GA.
4.
Post, D., Han, B., and Ifju, P., 1994, High Sensitivity Moire´, Springer, New York.
5.
Han
,
B.
,
Guo
,
Y.
,
Lim
,
C. K.
, and
Caletka
,
D.
,
1996
, “
Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
,”
ASME Trans. J. Electron. Packag.
,
118
, pp.
157
–
163
.
6.
Han
,
B.
,
1998
, “
Recent Advancements of Moire´ and Microscopic Moire´ Interferometry for Thermal Deformation Analysis of Microelectronic Devices
,”
Exp. Mech.
,
38
(
4
), pp.
278
–
288
.
7.
Pyland
,
J.
,
Pucha
,
R. V.
, and
Sitaraman
,
S. K.
,
2002
, “
Thermomechanical Reliability of Underfilled BGA Packages
,”
IEEE Trans. Electron. Packag. Manuf.
,
25
(
2
), pp.
100
–
106
.
Copyright © 2005
 by ASME
You do not currently have access to this content.