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Volume 146, Issue 3

September 2024

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Review Articles
Research Papers
Technical Briefs

Review Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu

J. Electron. Packag. September 2024, 146(3): 030801. doi: https://doi.org/10.1115/1.4064361

Abstract

View articletitled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

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Topics: Imaging , Inspection , Lasers , Microelectronic packaging , Resolution (Optics) , Nondestructive evaluation , Microscopy

Hybrid Bonding for Ultra-High-Density Interconnect

Mei-Chien Lu

J. Electron. Packag. September 2024, 146(3): 030802. doi: https://doi.org/10.1115/1.4064750

Abstracts

View articletitled, Hybrid Bonding for Ultra-High-Density Interconnect

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Topics: Bonding , Semiconductor wafers , Copper , Overlays (Materials engineering) , Design

Research Papers

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou

J. Electron. Packag. September 2024, 146(3): 031001. doi: https://doi.org/10.1115/1.4064354

Abstract

View articletitled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

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Topics: Finite element methods , Flip-chip packages , Gages , Strain gages , Warping

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

Meng-Kai Shih, Guan-Sian Lin, Jonny Yang

J. Electron. Packag. September 2024, 146(3): 031002. doi: https://doi.org/10.1115/1.4064355

Abstract

View articletitled, Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

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Topics: Delamination , Diffusion (Physics) , Fracture (Materials) , Manufacturing , Stress , Temperature , Design , Adhesion , Thermal stresses , Modeling

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang

J. Electron. Packag. September 2024, 146(3): 031003. doi: https://doi.org/10.1115/1.4064522

Abstracts

View articletitled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

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Topics: Algorithms , Artificial neural networks , Errors , Fracture (Materials) , Neural network models , Optimization algorithms , Reliability , Silicon , Finite element methods , Modeling

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

Yue Huang, Shang-Shu Li, Yan-Pei Gao, Hai-Bin Zhu, Gao-Yin He, Xiao-Hui Xie, Chun Lin

J. Electron. Packag. September 2024, 146(3): 031004. doi: https://doi.org/10.1115/1.4064703

Abstracts

View articletitled, Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

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Topics: Compression , Deformation , Finite element analysis , Flip-chip , Materials properties , Modeling , Bonding , Manufacturing

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan

J. Electron. Packag. September 2024, 146(3): 031005. doi: https://doi.org/10.1115/1.4064704

Abstracts

View articletitled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

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Topics: Errors , Kinematics , Packaging , Particle swarm optimization , Artificial neural networks , Design , Particulate matter , Trajectories (Physics) , Simulation , Displacement

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. September 2024, 146(3): 031006. doi: https://doi.org/10.1115/1.4064521

Abstracts

View articletitled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

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Topics: Elastic moduli , Mechanical properties , Solders , Stress , Stress-strain curves , Temperature , Tensile strength , Testing , Viscoplasticity , Finite element analysis

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff

J. Electron. Packag. September 2024, 146(3): 031007. doi: https://doi.org/10.1115/1.4064524

Abstracts

View articletitled, Characterization of a Rack-Level Thermosyphon-Based Cooling System

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Topics: Condensers (steam plant) , Cooling , Cooling systems , Data centers , Fluids , Heat , Heat recovery , Refrigerants , Stress , Temperature

Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

E. Stang, C. Lesko, D. Young

J. Electron. Packag. September 2024, 146(3): 031008. doi: https://doi.org/10.1115/1.4064751

Abstracts

View articletitled, Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

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Topics: Creep , Solders , Stress , Temperature , Testing , Alloys

Technical Briefs

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz

J. Electron. Packag. September 2024, 146(3): 034501. doi: https://doi.org/10.1115/1.4064523

Abstracts

View articletitled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

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Topics: Coolants , Fins , Numerical analysis , Plates (structures) , Pumps , Temperature , Temperature distribution , Thermal management , Thermal resistance , Flow (Dynamics)

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

J. Electron. Packag. September 2024, 146(3): 034502. doi: https://doi.org/10.1115/1.4064604

Abstracts

View articletitled, Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

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Topics: Epoxy adhesives , Epoxy resins , Fracture (Materials) , Fracture toughness , Stress , Delamination , Temperature , Reliability , Printed circuit boards

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Review Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Hybrid Bonding for Ultra-High-Density Interconnect

Research Papers

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Characterization of a Rack-Level Thermosyphon-Based Cooling System

Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

Technical Briefs

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

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