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Issues
June 2004
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
J. Electron. Packag. June 2004, 126(2): 177–185.
doi: https://doi.org/10.1115/1.1649243
Topics:
Grinding
,
Semiconductor wafers
,
Wire
A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps
J. Electron. Packag. June 2004, 126(2): 186–194.
doi: https://doi.org/10.1115/1.1649244
Topics:
Flow (Dynamics)
,
Flow simulation
,
Permeability
,
Plates (structures)
,
Porous materials
,
Simulation
,
Solders
,
Shapes
,
Cylinders
Characterization of Substrate Materials for System-in-a-Package Applications
J. Electron. Packag. June 2004, 126(2): 195–201.
doi: https://doi.org/10.1115/1.1648057
Topics:
Ceramics
,
Cooling
,
Density
,
Epoxy resins
,
Finite element methods
,
Manufacturing
,
Microwaves
,
Reliability
,
System-in-package
,
Thermal expansion
Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
J. Electron. Packag. June 2004, 126(2): 202–207.
doi: https://doi.org/10.1115/1.1756143
Topics:
Adhesion
,
Aluminum
,
Cycles
,
Damage
,
Delamination
,
Dielectric materials
,
Displacement
,
Flip-chip packages
,
Fracture (Materials)
,
Fracture (Process)
Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
J. Electron. Packag. June 2004, 126(2): 208–212.
doi: https://doi.org/10.1115/1.1756144
Topics:
Alloys
,
Solders
,
Temperature
,
Eutectic alloys
,
Lead-free solders
,
Tin
,
Hardening
,
Tensile strength
Transport Phenomena in Two-Phase Micro-Channel Heat Sinks
J. Electron. Packag. June 2004, 126(2): 213–224.
doi: https://doi.org/10.1115/1.1756145
Topics:
Boiling
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Pressure drop
,
Two-phase flow
,
Heat transfer
,
Water
,
Temperature
,
Hydrodynamic stability
Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
J. Electron. Packag. June 2004, 126(2): 225–231.
doi: https://doi.org/10.1115/1.1756146
Topics:
Failure
,
Solders
,
Stress
,
Temperature
,
Testing
,
Thermomechanics
,
Modeling
,
Electronic packaging
,
Fracture (Process)
,
Constitutive equations
Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation
J. Electron. Packag. June 2004, 126(2): 232–236.
doi: https://doi.org/10.1115/1.1756147
Topics:
Calibration
,
Modeling
,
Solders
,
Temperature
,
Testing
,
Finite element analysis
,
Electronic packaging
,
Shear (Mechanics)
,
Stress
,
Boundary-value problems
Development of G-Helix Structure as Off-Chip Interconnect
J. Electron. Packag. June 2004, 126(2): 237–246.
doi: https://doi.org/10.1115/1.1756148
Topics:
Design
,
Displacement
,
Geometry
,
Manufacturing
,
Optimization
,
Packaging
,
Reliability
,
Solders
,
Stress
,
Thermomechanics
Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
J. Electron. Packag. June 2004, 126(2): 247–255.
doi: https://doi.org/10.1115/1.1756149
Topics:
Flow (Dynamics)
,
Fluid dynamics
,
Heat sinks
,
Heat transfer
,
Modeling
,
Porous materials
,
Temperature distribution
,
Permeability
,
Pressure drop
Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
J. Electron. Packag. June 2004, 126(2): 256–264.
doi: https://doi.org/10.1115/1.1756150
Topics:
Avionics
,
Creep
,
Cycles
,
Military systems
,
Solders
,
Temperature
,
Damage
Warpage Analysis of Underfilled Wafers
J. Electron. Packag. June 2004, 126(2): 265–270.
doi: https://doi.org/10.1115/1.1707036
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