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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041120.
Paper No: EP-24-1041
Published Online: September 30, 2024
Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag.
Paper No: EP-24-1089
Published Online: September 30, 2024
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 1 SEM micrograph of ePCM particles with paraffin core and titania shell More about this image found in SEM micrograph of ePCM particles with paraffin core and titania shell
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 2 Size distribution of ePCM particles More about this image found in Size distribution of ePCM particles
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 3 Heat flow curves with increasing temperature for composite gels of first sample test More about this image found in Heat flow curves with increasing temperature for composite gels of first sa...
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 4 Heat flow curves with decreasing temperature for gel composites of first sample test More about this image found in Heat flow curves with decreasing temperature for gel composites of first sa...
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 5 Peak solid–liquid transition ( a ) and peak liquid–solid transition and ( b ) temperatures varied ePCM loading More about this image found in Peak solid–liquid transition ( a ) and peak liquid–solid transition and ( b...
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 6 Latent heat capacity values for all tested samples as a function of ePCM loading percentage More about this image found in Latent heat capacity values for all tested samples as a function of ePCM lo...
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 7 Specific heat capacity curves for the composite gels for first samples More about this image found in Specific heat capacity curves for the composite gels for first samples
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 8 ( a ) Specific heat capacities for 30 °C, ( b ) 75 °C, and ( c ) 125 °C based on ePCM loading percentage More about this image found in ( a ) Specific heat capacities for 30 °C, ( b ) 75 °C, and ( c ) 125 °C bas...
Image
in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 9 CTE for composites as function of ePCM loading More about this image found in CTE for composites as function of ePCM loading
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 10 Elastic modulus as a function of temperature and ePCM loading fraction More about this image found in Elastic modulus as a function of temperature and ePCM loading fraction
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 11 Breakdown test experimental setup for point-point configuration More about this image found in Breakdown test experimental setup for point-point configuration
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 12 Breakdown voltage results by weight percent ePCM added More about this image found in Breakdown voltage results by weight percent ePCM added
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 13 Experimental setup for needle-plane breakdown voltage testing More about this image found in Experimental setup for needle-plane breakdown voltage testing
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in Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
> Journal of Electronic Packaging
Published Online: September 30, 2024
Fig. 14 Breakdown voltage for needle-plane testing as a function ePCM loading for 0.10 and 0.25 mm electrode gaps More about this image found in Breakdown voltage for needle-plane testing as a function ePCM loading for 0...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
Published Online: September 12, 2024
Image
in Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
> Journal of Electronic Packaging
Published Online: September 12, 2024
Fig. 1 Cantilever beam image with trace and sample dimensions More about this image found in Cantilever beam image with trace and sample dimensions
Image
in Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
> Journal of Electronic Packaging
Published Online: September 12, 2024
Fig. 2 Cantilever beam images with zoomed-in images of the traces: ( a ) extrusion printing and ( b ) AJP More about this image found in Cantilever beam images with zoomed-in images of the traces: ( a ) extrusion...
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in Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
> Journal of Electronic Packaging
Published Online: September 12, 2024
Fig. 3 SEM images of the extrusion printed silver traces: ( a ) ×340 magnification and ( b ) ×1074 magnification More about this image found in SEM images of the extrusion printed silver traces: ( a ) ×340 magnification...
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