1-20 of 107
Bonding
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Optimization of Micropillars Electroplating Bonding Processes and Additives

Available to Purchase
Qiang Zhang, Changping Chen, Haoze Yang, Jiameng Zhang, Mengtao Xiao, Long Dou, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021008.
Paper No: EP-24-1086
https://doi.org/10.1115/1.4067651
Published Online: February 4, 2025
View Articletitled, Optimization of Micropillars Electroplating Bonding Processes and Additives
Open the PDF for Optimization of Micropillars Electroplating Bonding Processes and Additives in another window
Topics: Bonding, Convection, Copper, Electroplating, Flow (Dynamics), Current density, Columns (Structural)
Journal Articles

A Review of Mechanism and Technology of Hybrid Bonding

Available to Purchase
Yipeng Xu, Yanping Zeng, Yi Zhao, Choonghyun Lee, Minhui He, Zongfang Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2025, 147(1): 010801.
Paper No: EP-23-1084
https://doi.org/10.1115/1.4065650
Published Online: July 25, 2024
View Articletitled, A Review of Mechanism and Technology of Hybrid Bonding
Open the PDF for A Review of Mechanism and Technology of Hybrid Bonding in another window
Topics: Bonding
Journal Articles

Hybrid Bonding for Ultra-High-Density Interconnect

Available to Purchase
Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030802.
Paper No: EP-23-1064
https://doi.org/10.1115/1.4064750
Published Online: March 8, 2024
View Articletitled, Hybrid Bonding for Ultra-High-Density Interconnect
Open the PDF for Hybrid Bonding for Ultra-High-Density Interconnect in another window
Topics: Bonding, Semiconductor wafers, Copper, Overlays (Materials engineering), Design
Journal Articles

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

Available to Purchase
Yue Huang, Shang-Shu Li, Yan-Pei Gao, Hai-Bin Zhu, Gao-Yin He, Xiao-Hui Xie, Chun Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
https://doi.org/10.1115/1.4064703
Published Online: February 28, 2024
View Articletitled, Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
Open the PDF for Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis in another window
Topics: Compression, Deformation, Finite element analysis, Flip-chip, Materials properties, Modeling, Bonding, Manufacturing
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Available to Purchase
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Articletitled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
Open the PDF for Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform in another window
Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Hybrid Substrates for Heterogeneous Integration

Available to Purchase
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
https://doi.org/10.1115/1.4062993
Published Online: August 11, 2023
View Articletitled, Hybrid Substrates for Heterogeneous Integration
Open the PDF for Hybrid Substrates for Heterogeneous Integration in another window
Topics: Bonding, Metals, Solder joints, Reliability, Dielectric materials
Journal Articles

Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging

Available to Purchase
John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2024, 146(1): 010801.
Paper No: EP-23-1022
https://doi.org/10.1115/1.4062529
Published Online: June 23, 2023
View Articletitled, Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
Open the PDF for Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging in another window
Topics: Bonding, Bridges (Structures), Design, Packaging
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Available to Purchase
Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Articletitled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
Open the PDF for Design and Fabrication of Leadless Package Structure for Pressure Sensors in another window
Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Available to Purchase
Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
https://doi.org/10.1115/1.4052069
Published Online: September 24, 2021
View Articletitled, Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors
Open the PDF for Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors in another window
Topics: Sensors, Bonding, Electronics
Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Available to Purchase
Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Articletitled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
Open the PDF for Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging in another window
Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Available to Purchase
Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Articletitled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
Open the PDF for Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint in another window
Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Available to Purchase
Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
https://doi.org/10.1115/1.4049129
Published Online: January 19, 2021
View Articletitled, Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
Open the PDF for Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores in another window
Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Available to Purchase
Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Available to Purchase
Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Articletitled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach in another window
Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Available to Purchase
Wenbo Zhu, Xiaoting Wang, Mingyu Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
https://doi.org/10.1115/1.4046341
Published Online: March 9, 2020
View Articletitled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
Open the PDF for Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures in another window
Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting
Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Available to Purchase
Xiaohui Song, Rui Zhang, Huadong Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021005.
Paper No: EP-19-1105
https://doi.org/10.1115/1.4046164
Published Online: February 19, 2020
View Articletitled, Atomic Study on Copper–Copper Bonding Using Nanoparticles
Open the PDF for Atomic Study on Copper–Copper Bonding Using Nanoparticles in another window
Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Available to Purchase
Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
Open the PDF for Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems in another window
Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Available to Purchase
Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011004.
Paper No: EP-18-1055
https://doi.org/10.1115/1.4041984
Published Online: February 25, 2019
View Articletitled, Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
Open the PDF for Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition in another window
Topics: Bonding, Shock (Mechanics), Wire, Risk assessment
Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Available to Purchase
Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
https://doi.org/10.1115/1.4040794
Published Online: August 6, 2018
View Articletitled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
Open the PDF for Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding in another window
Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices
Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Available to Purchase
Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
https://doi.org/10.1115/1.4040002
Published Online: May 11, 2018
View Articletitled, Edge Trimming Induced Defects on Direct Bonded Wafers
Open the PDF for Edge Trimming Induced Defects on Direct Bonded Wafers in another window
Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding