Page 1 | Search Results | J. Electron. Packag.

1-20 of 323

Sort by

Sort Order Select

Journal Articles

Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

Aakash Mani, Jahar Sarkar

Publisher: ASME

J. Electron. Packag. June 2025, 147(2): 021010.

Paper No: EP-24-1093

https://doi.org/10.1115/1.4067775

Published Online: February 28, 2025

View Articletitled, Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

Topics: Cooling, Heat, Temperature, Thermoelectric coolers, Thermoelectricity, Design, Simulation

Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson

Publisher: ASME

J. Electron. Packag. June 2025, 147(2): 021009.

Paper No: EP-24-1066

https://doi.org/10.1115/1.4067649

Published Online: February 20, 2025

View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling

Journal Articles

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti

Publisher: ASME

J. Electron. Packag. June 2025, 147(2): 021003.

Paper No: EP-24-1082

https://doi.org/10.1115/1.4067136

Published Online: December 11, 2024

View Articletitled, Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

Topics: Artificial intelligence, Cooling, Data centers, Energy consumption, Graphics processing units, Machine learning, Temperature, Stress, Coolants

Journal Articles

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Joshua Kasitz, Muhammad Ghufran, David Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041120.

Paper No: EP-24-1041

https://doi.org/10.1115/1.4066480

Published Online: September 30, 2024

View Articletitled, Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Topics: Composite materials, Phase change materials, Silicones, Temperature, Particulate matter, Testing, Cooling, Insulation, Needles, Latent heat

Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041117.

Paper No: EP-24-1030

https://doi.org/10.1115/1.4065948

Published Online: August 17, 2024

View Articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration

Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041111.

Paper No: EP-24-1027

https://doi.org/10.1115/1.4065947

Published Online: August 9, 2024

View Articletitled, Convection Cooling of Power Electronics Operating in Deep-Space

Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling

Journal Articles

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041110.

Paper No: EP-24-1024

https://doi.org/10.1115/1.4065988

Published Online: August 9, 2024

View Articletitled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Topics: Batteries, Cycles, Temperature, Thermal management, Cooling

Journal Articles

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041113.

Paper No: EP-24-1048

https://doi.org/10.1115/1.4065987

Published Online: August 9, 2024

View Articletitled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Topics: Computational fluid dynamics, Cooling, Design, Heat sinks, Natural convection, Temperature, Triply periodic minimal surfaces, Manufacturing, Porosity

Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041112.

Paper No: EP-24-1042

https://doi.org/10.1115/1.4066044

Published Online: August 9, 2024

View Articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability

Journal Articles

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041106.

Paper No: EP-24-1021

https://doi.org/10.1115/1.4065942

Published Online: July 26, 2024

View Articletitled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Topics: Air conditioning, Coolants, Cooling, Temperature, Vehicles, Stress, Heat, HVAC equipment, Noise (Sound), Flow (Dynamics)

Journal Articles

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041105.

Paper No: EP-24-1033

https://doi.org/10.1115/1.4065863

Published Online: July 25, 2024

View Articletitled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Topics: Condensers (steam plant), Cooling systems, Fluids, Heat, Secondary cells, Stress, Temperature, Thermal resistance, Pipeline risers, Risers (Casting)

Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041104.

Paper No: EP-24-1025

https://doi.org/10.1115/1.4065944

Published Online: July 25, 2024

View Articletitled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators

Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041102.

Paper No: EP-24-1007

https://doi.org/10.1115/1.4065537

Published Online: June 17, 2024

View Articletitled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems

Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041101.

Paper No: EP-24-1006

https://doi.org/10.1115/1.4065446

Published Online: May 24, 2024

View Articletitled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants

Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff

Publisher: ASME

J. Electron. Packag. September 2024, 146(3): 031007.

Paper No: EP-23-1068

https://doi.org/10.1115/1.4064524

Published Online: March 11, 2024

View Articletitled, Characterization of a Rack-Level Thermosyphon-Based Cooling System

Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature

Journal Articles

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff

Publisher: ASME

J. Electron. Packag. June 2024, 146(2): 021005.

Paper No: EP-23-1016

https://doi.org/10.1115/1.4063252

Published Online: November 10, 2023

View Articletitled, Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

Topics: Flow (Dynamics), Heat exchangers, Refrigerants, Temperature, Heat, Cooling, Fluids, Pressure

Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 040301.

Paper No: EP-23-1077

https://doi.org/10.1115/1.4063893

Published Online: November 1, 2023

View Articletitled, Special Issue on InterPACK2022

Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion

Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 041103.

Paper No: EP-23-1032

https://doi.org/10.1115/1.4063484

Published Online: October 9, 2023

View Articletitled, Converging Jet Impingement for Enhanced Liquid Cooling

Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation

Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 041102.

Paper No: EP-23-1038

https://doi.org/10.1115/1.4063325

Published Online: October 5, 2023

View Articletitled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin

Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li

Publisher: ASME

J. Electron. Packag. September 2023, 145(3): 031010.

Paper No: EP-22-1063

https://doi.org/10.1115/1.4062530

Published Online: June 23, 2023

View Articletitled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation

Update search

Journal citation

NARROW

Format

Article Type

Supplemental Material

Subject Area

Topics

Date

Availability

Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Convection Cooling of Power Electronics Operating in Deep-Space

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Characterization of a Rack-Level Thermosyphon-Based Cooling System

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

Special Issue on InterPACK2022

Converging Jet Impingement for Enhanced Liquid Cooling

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Update search

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only