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Journal Articles

Microbead Encapsulation for Protection of Electronic Components

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Jeffrey R Hill, Alex Chen, Natasha Wilson, Cayden Boll, MeiLi O’Bannon, Dallan Trentman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021007.
Paper No: EP-24-1085
https://doi.org/10.1115/1.4067650
Published Online: February 4, 2025
View Articletitled, Microbead Encapsulation for Protection of Electronic Components
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Topics: Compacting, Electronic components, Epoxy resins, Printed circuit boards, Shock (Mechanics), Surface roughness, Testing, Modeling, Failure, Stress
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

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Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Articletitled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

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Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Articletitled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
Open the PDF for Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current in another window
Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

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Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031006.
Paper No: EP-21-1025
https://doi.org/10.1115/1.4051647
Published Online: September 15, 2021
View Articletitled, Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

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Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Articletitled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

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Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011009.
Paper No: EP-20-1126
https://doi.org/10.1115/1.4050898
Published Online: August 6, 2021
View Articletitled, Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages
Open the PDF for Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages in another window
Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density
Journal Articles

Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions

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Alex Davila-Frias, Shah Limon, Val Marinov, Om Prakash Yadav
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021003.
Paper No: EP-20-1042
https://doi.org/10.1115/1.4048035
Published Online: August 27, 2020
View Articletitled, Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions
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Topics: Damage, Failure, Reliability, Stress, Electronics
Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

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Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
https://doi.org/10.1115/1.4046849
Published Online: April 24, 2020
View Articletitled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

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Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Articletitled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

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Mahsa Montazeri, Cody J. Marbut, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
https://doi.org/10.1115/1.4043480
Published Online: May 24, 2019
View Articletitled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
Open the PDF for Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test in another window
Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis
Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

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Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
https://doi.org/10.1115/1.4043405
Published Online: May 17, 2019
View Articletitled, A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders
Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

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Yasuhiro Kimura, Masumi Saka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
https://doi.org/10.1115/1.4042980
Published Online: April 10, 2019
View Articletitled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms
Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

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Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
https://doi.org/10.1115/1.4040002
Published Online: May 11, 2018
View Articletitled, Edge Trimming Induced Defects on Direct Bonded Wafers
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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding
Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

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Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
https://doi.org/10.1115/1.4039301
Published Online: May 9, 2018
View Articletitled, Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue
Journal Articles

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

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Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
https://doi.org/10.1115/1.4036363
Published Online: April 24, 2017
View Articletitled, Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
Open the PDF for Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope in another window
Topics: Contamination, Corrosion, Data centers, Particulate matter, Temperature, Cooling, Reliability, Damage, Failure
Journal Articles

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

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David A. Roberson, Ryan B. Wicker, Eric MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
https://doi.org/10.1115/1.4030286
Published Online: September 1, 2015
View Articletitled, Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
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Topics: Electronics, Hardening (Curing), Inks, Temperature, Additive manufacturing, Silver, Manufacturing, Damage
Journal Articles

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

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Pradeep Lall, Hao Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021002.
Paper No: EP-14-1002
https://doi.org/10.1115/1.4028957
Published Online: June 1, 2015
View Articletitled, Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter
Open the PDF for Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter in another window
Topics: Filters, Light-emitting diodes, Particulate matter, Damage, Failure, Temperature, Physics
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

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Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Articletitled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

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Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Articletitled, Stress–Strain Behavior of SAC305 at High Strain Rates
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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Special Section on InterPACK 2013

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Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Articletitled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management