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Journal Articles

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

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Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
https://doi.org/10.1115/1.4064604
Published Online: March 7, 2024
View Articletitled, Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure
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Topics: Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Delamination, Temperature, Reliability, Printed circuit boards
Journal Articles

Interfacial Fracture Caused by Electromigration at Copper Interconnects

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Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
https://doi.org/10.1115/1.4062828
Published Online: July 14, 2023
View Articletitled, Interfacial Fracture Caused by Electromigration at Copper Interconnects
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Topics: Copper, Electrodiffusion, Fracture (Materials), Fracture (Process), Stress, Fracture toughness, Dislocations, Anodes
Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

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Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Articletitled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

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Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Articletitled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

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Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
https://doi.org/10.1115/1.2386242
Published Online: October 4, 2006
View Articletitled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
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Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness
Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

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Liqiang Cao, Zonghe Lai, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
https://doi.org/10.1115/1.1846066
Published Online: March 21, 2005
View Articletitled, Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
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Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure
Journal Articles

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

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A. Polyakov, M. Bartek, J. N. Burghartz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
https://doi.org/10.1115/1.1846059
Published Online: March 21, 2005
View Articletitled, Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
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Topics: Adhesives, Bonding, Semiconductor wafers, Fracture toughness, Wedges, Tensile strength
Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

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Mitul Modi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
https://doi.org/10.1115/1.1772410
Published Online: October 6, 2004
View Articletitled, Interfacial Fracture Toughness Measurement of a Ti/Si Interface
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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives
Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

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Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
https://doi.org/10.1115/1.1647123
Published Online: April 30, 2004
View Articletitled, Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching
Journal Articles

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

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Timothy Ferguson, Mem. ASME, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
https://doi.org/10.1115/1.1524132
Published Online: March 14, 2003
View Articletitled, Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
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Topics: Absorption, Diffusion (Physics), Fracture (Materials), Fracture (Process), Resins, Fracture toughness
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

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Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Articletitled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

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J. Auersperg, E. Kieselstein, A. Schubert, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 318–322.
https://doi.org/10.1115/1.1501303
Published Online: December 12, 2002
View Articletitled, Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches
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Topics: Delamination, Finite element analysis, Fracture (Materials), Fracture mechanics, Stress, Fracture toughness, Reliability, Fracture (Process), Integrated circuits, Risk assessment
Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

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Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
https://doi.org/10.1115/1.1481374
Published Online: July 26, 2002
View Articletitled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate
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Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite
Journal Articles

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

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Timothy Ferguson, Member ASME, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
https://doi.org/10.1115/1.1414133
Published Online: May 2, 2002
View Articletitled, Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
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Topics: Absorption, Adhesion, Fracture (Materials), Fracture toughness, Solder masks, Delamination, Stress, Flow (Dynamics), Fracture (Process)
Journal Articles

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

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Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 67–72.
https://doi.org/10.1115/1.483137
Published Online: December 9, 1999
View Articletitled, Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
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Topics: Design, Electronic packages, Electronic packaging, Fracture (Materials), Fracture (Process), Fracture toughness, Stress, Testing, Geometry, Packaging
Journal Articles

Determination of Fracture Toughness for Metal/Polymer Interfaces

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V. Sundararaman, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 275–281.
https://doi.org/10.1115/1.2793852
Published Online: December 1, 1999
View Articletitled, Determination of Fracture Toughness for Metal/Polymer Interfaces
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Topics: Fracture toughness, Metals, Polymers, Finite element analysis, Fracture (Materials), Electronic packaging
Journal Articles

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

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Adam Kuhl, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 147–151.
https://doi.org/10.1115/1.483147
Published Online: September 15, 1999
View Articletitled, A Technique to Measure Interfacial Toughness Over a Range of Phase Angles
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Topics: Adhesives, Fracture (Materials), Fracture mechanics, Fracture toughness, Stress, Finite element analysis, Testing
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

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A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Articletitled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Adhesion and Reliability of Polymer/Inorganic Interfaces

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S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 328–335.
https://doi.org/10.1115/1.2792642
Published Online: December 1, 1998
View Articletitled, Adhesion and Reliability of Polymer/Inorganic Interfaces
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Journal Articles

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

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J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 349–353.
https://doi.org/10.1115/1.2792645
Published Online: December 1, 1998
View Articletitled, Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses
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Topics: Cantilever beams, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Thermal stresses