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Journal Articles

Microbead Encapsulation for Protection of Electronic Components

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Jeffrey R Hill, Alex Chen, Natasha Wilson, Cayden Boll, MeiLi O’Bannon, Dallan Trentman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021007.
Paper No: EP-24-1085
https://doi.org/10.1115/1.4067650
Published Online: February 4, 2025
View Articletitled, Microbead Encapsulation for Protection of Electronic Components
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Topics: Compacting, Electronic components, Epoxy resins, Printed circuit boards, Shock (Mechanics), Surface roughness, Testing, Modeling, Failure, Stress
Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

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Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

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Jin Cui, Liang Pan, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
https://doi.org/10.1115/1.4047356
Published Online: June 8, 2020
View Articletitled, Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

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M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Articletitled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

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Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Articletitled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

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Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Articletitled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

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Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011001.
https://doi.org/10.1115/1.4005955
Published Online: March 19, 2012
View Articletitled, A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact
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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)
Journal Articles

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

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M. F. Rosle, S. Abdullah, M. A. A. Hamid, A. R. Daud, A. Jalar, Z. Kornain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
https://doi.org/10.1115/1.4002728
Published Online: December 9, 2010
View Articletitled, Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding
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Topics: Bonding, Surface roughness
Journal Articles

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

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K. N. Prabhu, G. Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
https://doi.org/10.1115/1.4002899
Published Online: November 19, 2010
View Articletitled, Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
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Topics: Solders, Surface roughness, Tin, Wetting, Relaxation (Physics)
Journal Articles

Test Methods for Silicon Die Strength

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M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
View Articletitled, Test Methods for Silicon Die Strength
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

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Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
https://doi.org/10.1115/1.2351902
Published Online: December 24, 2005
View Articletitled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat
Journal Articles

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

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M. Bahrami, M. M. Yovanovich, E. E. Marotta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 23–29.
https://doi.org/10.1115/1.2159005
Published Online: May 11, 2005
View Articletitled, Thermal Joint Resistance of Polymer-Metal Rough Interfaces
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Topics: Deformation, Metals, Polymers, Surface roughness, Thermal resistance, Temperature, Microhardness
Journal Articles

Effects of Two-Dimensional Roughness in Flow in Microchannels

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Xiang-Qi Wang, Christopher Yap, Arun Sadashiv Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
https://doi.org/10.1115/1.1997164
Published Online: August 5, 2004
View Articletitled, Effects of Two-Dimensional Roughness in Flow in Microchannels
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Topics: Poiseuille flow, Surface roughness, Friction, Flow (Dynamics), Microchannels
Journal Articles

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

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Hong-Seok Min, Young-Chang Joo, Oh-Sung Song
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
https://doi.org/10.1115/1.1649238
Published Online: April 30, 2004
View Articletitled, Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
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Topics: Annealing, Bonding, Glass, Semiconductor wafers, Temperature, Surface roughness, Scanning probe microscopy
Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

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Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
https://doi.org/10.1115/1.1647123
Published Online: April 30, 2004
View Articletitled, Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching
Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

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Wataru Nakayama, Arthur E. Bergles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 192–199.
https://doi.org/10.1115/1.1568127
Published Online: June 10, 2003
View Articletitled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective
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Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer
Journal Articles

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

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Qizhou Yao, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
https://doi.org/10.1115/1.1459470
Published Online: May 2, 2002
View Articletitled, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness
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Topics: Adhesion, Electronic packaging, Failure, Fracture (Materials), Metals, Polymers, Surface roughness, Interface roughness, Aluminum, Fracture mechanics
Journal Articles

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

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K. Verma, B. Han, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 227–232.
https://doi.org/10.1115/1.1286315
Published Online: December 20, 1999
View Articletitled, Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Surface roughness, Warping, Microelectronic devices
Journal Articles

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

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J. K. Shang, Daping Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 170–173.
https://doi.org/10.1115/1.2792148
Published Online: September 1, 1996
View Articletitled, Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints
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Topics: Fatigue cracks, Interface roughness, Solder joints, Tin, Fracture (Materials), Elasticity, Fracture mechanics, Intermetallic compounds, Shear strength, Solders
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

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Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Articletitled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
Open the PDF for Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach in another window
Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure