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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Available to Purchase
Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
https://doi.org/10.1115/1.4065947
Published Online: August 9, 2024
View Articletitled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling
Journal Articles

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Available to Purchase
Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041110.
Paper No: EP-24-1024
https://doi.org/10.1115/1.4065988
Published Online: August 9, 2024
View Articletitled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
Open the PDF for Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies in another window
Topics: Batteries, Cycles, Temperature, Thermal management, Cooling
Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Available to Purchase
Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Articletitled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Free
Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Articletitled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Special Section on InterPACK2021

Free
Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Free
Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Free
Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Articletitled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
Open the PDF for Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft in another window
Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Available to Purchase
Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Articletitled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
Open the PDF for Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices in another window
Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Special Issue on InterPACK2020

Free
Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Articletitled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Available to Purchase
Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Articletitled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Free
Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Articletitled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Available to Purchase
Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Articletitled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Available to Purchase
Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Articletitled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

Available to Purchase
John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Articletitled, A Review on Transient Thermal Management of Electronic Devices
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Available to Purchase
Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
https://doi.org/10.1115/1.4049294
Published Online: February 22, 2021
View Articletitled, Modular Heat Sinks for Enhanced Thermal Management of Electronics
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Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing
Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Available to Purchase
Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041004.
Paper No: EP-20-1034
https://doi.org/10.1115/1.4048493
Published Online: October 12, 2020
View Articletitled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Open the PDF for Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization in another window
Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

Available to Purchase
H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
View Articletitled, A System to Package Perspective on Transient Thermal Management of Electronics
Open the PDF for A System to Package Perspective on Transient Thermal Management of Electronics in another window
Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Open Access
Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Articletitled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy