... chip structure joined by Sn-37wt%Pb eutectic solder bumps 150 μ m in diameter. Consequently, the process of phase growth and crack propagation was determined via observation of consecutive computed tomography (CT) images obtained in the same plane of the same specimen. As the thermal cycle proceeded...

.... Finally, the half-empirical Paris equation, which can be used as a design base of delamination reliability in flip chip package, has been determined from the crack propagation rates measured and the energy release rates simulated. Contributed by the Electronic and Photonic Packaging Division...