... than other restraint technologies. In potted electronic assemblies, interfacial delamination at the epoxy and printed circuit board (PCB) interface has been one of the major failure modes. Interfacial delamination happens at the epoxy/PCB interface under dynamic shock loads, which leads to failures...

... analysis J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation Flip chip on broad (FCOB) is being increasingly used for a wide range of applications such as computers, portable electronics and automotive application. The FCOB provides shorter...