... parameters for enhanced system-level thermal performance. Characterization of an interface material between a silicon device and a metal heat spreader can be accomplished via several techniques. In this research, high-magnification radiography with computed tomography, acoustic microscopy, and scanning...

.... In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy...

... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Oct. 2003. Associate Editor: Z. Suo. 01 Oct 2003 30 04 2004 cracks inspection failure analysis chip-on-board packaging flip-chip devices fracture mechanics delamination acoustic microscopy finite element...

...Xia Cai; Liu Chen; Qun Zhang; Bulu Xu; Weidong Huang; Xiaoming Xie; Zhaonian Cheng The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill for two types of flip-chip packages was investigated by conducting thermal cycling test, scanning acoustic microscopy...

... have been detected by use of scanning acoustic microscopy (SAM). Defects in buried capacitors caused by thermal shock have also been clearly observed. The results show that SAM can be a powerful analytical tool for the nondestructive evaluation of delaminations in buried passive components. Through...

... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...