...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...

... 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display...

.../ACFs) or the nonconductive adhesives/films (NCAs/NCFs), and the former is more widely used than the latter. nonconductive film (NCF) chip on glass (COG) warpage the thermocompression bonding chip-on-board packaging thermal stresses 08 11 2008 26 05 2008 29 10 2009...

... received November 15, 2004. Review conducted by: Y. C. Chan. Packaging. 01 October 2003 06 January 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability...

..., 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...

... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...

... in the dominant heat flow path and/or by increasing heat area in that path. A brief review of the past work follows. ball grid arrays plastic packaging chip-on-board packaging flip-chip devices integrated circuit packaging thermal management (packaging) thermal conductivity natural convection...

... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Oct. 2003. Associate Editor: Z. Suo. 01 Oct 2003 30 04 2004 cracks inspection failure analysis chip-on-board packaging flip-chip devices fracture mechanics delamination acoustic microscopy finite element...

... March 15, 2002. Associate Editor: D. T. Read. tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity viscoplasticity thermal expansion shear...

... 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB) samples is greatly increased by the introduction...

...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...

... for minimizing edge stresses in IC packages are presented. [S1043-7398(00)00904-X] Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associated Technical Editor: M. Shiratori. flip-chip devices chip-on-board packaging integrated...

... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters October 10, 2000. Associate Editor: J. Lau 10 October 2000 flip-chip devices chip-on-board packaging chip scale packaging circuit reliability stress analysis failure analysis finite element...

... is large (Finot et al. 4 ). flip-chip devices chip-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment 10 September 1999 21 March 2000 Contributed by the Electrical...

... packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging 05 April 1999 17 August 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC...