...Meng-Kai Shih; Guan-Sian Lin; Jonny Yang Delamination failure is one of the most prevalent and serious reliability issues in micro-electronic packaging. To understand this phenomenon further, this study constructs an experimental test system consisting of a double cantilever beam (DCB) fixture...

... the assembly processes. Thermal expansion mismatch between different materials causes interface delamination between epoxy molding compound and silicon die as well as interface delamination between underfill and silicon die. The main objective of this study is to investigate the effects of underfill material...

... as the elastic mismatch. 22 02 2009 18 09 2009 25 02 2010 25 02 2010 delamination mechanical testing shear strength thin films delamination blister test energy release rate phase angle shear effect Thin films have been finding more and more applications in diverse...

.... The oxidized leadframe provided a poor surface to attach adhesive and a higher microstrain on cyclic load, resulting in a negative effect on package reliability, such as a crack phenomenon at the epoxy interface between the die and the leadframe. This occurrence may ultimately cause delamination, which occurs...

...Saketh Mahalingam; Ananth Prabhakumar; Sandeep Tonapi; Suresh K. Sitaraman The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In this paper, the propagation...

... between conductive particle and conductive track is disrupted due to delamination of the cured resin during the elastic recovery. The authors have shown in previous studies that the delamination is caused by high residual stresses and that it largely depends on the adhesion strength of the assembly...

... the solder bump reliability, if the underfills do not prematurely delaminate or crack. Therefore, it is necessary to understand the risk of underfill delamination during assembly and during further thermal excursions. In this paper, the interface between silicon nitride ( SiN ) passivation and a nano-filled...

... of the EMC-Cu system widely used in electronic package design. 26 07 2005 14 03 2006 electronics packaging molecular dynamics method reliability adhesion assembling delamination thermal cycling molecular dynamics cuprous oxide content interfacial adhesion Reliability...

... integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive bonding anisotropic media deformation Weibull distribution acoustic microscopy Anisotropic Conductive Adhesive Joint Moire´ Interferometry Thermal Deformation Thermal Cycling...

...Mitul Modi; Suresh K. Sitaraman Titanium adhesive layers are commonly used in microelectronic and MEMS applications to help improve the adhesion of other metal layers to a silicon substrate. Such Ti/Si interfaces could potentially delaminate under externally applied mechanical loads, thermally...

... of thermal stresses and hygrostresses that arise during solder reflow of plastic IC packages. In recent years interfacial fracture mechanics has been applied successfully to the analysis of delamination or crack propagation along interfaces in plastic IC packages. This paper presents some fundamental aspects...

...Hai Ding; I. Charles Ume; Cheng Zhang Wafer-level packaging (WLP) is one of the future trends in electronic packaging. Since 1994, many companies have released various WLP licenses. One of the common concerns of WLP is wafer warpage. Warpage of wafers tends to introduce cracking or delamination...

... the mechanical reliability of flip chip using anisotropic conductive films (ACFs) often depends upon the interface characteristics between the bumping/passivation dielectrics and adjacent materials. This paper investigates the delamination and cracking in polymeric bumping/passivation dielectrics (Cyclotene™...

...Ji Hyuck Yang; Kang Yong Lee The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process shows elastic and viscoelastic behaviors and to suggest the optimum design...

... with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance...

... near the crack tip can be used as energy release rate at the interface between chip and underfill. Meanwhile, the delamination propagation rates at the interface was measured by using C-mode scanning acoustic microscope (C-SAM) inspection for two types of flip chip packages under thermal cycle loading...

...A. A. O. Tay; K. H. Lee; K. M. Lim Delamination of interfaces in integrated circuit (IC) packages gives rise to electrical and mechanical failures such as popcorn cracking. Hence it is important to be able to analyze the mechanics of delamination from small interfacial defects which may exist...

...C. J. Liu; L. J. Ernst; G. Wisse; G. Q. Zhang; M. Vervoort Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package...

...Takehiro Saitoh; Hidehito Matsuyama; Masayuki Toya Using Kr 85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in large-scale integrated circuit (LSI) plastic packages with either Cu alloy or alloy 42 leadframes are experimentally...

... analysis is focused on delamination along the chip-underfill interface due to thermal loading. The underfill is modeled as a composite material made of a polymer matrix and silica particles. Interfacial stresses are studied for several particle configurations: cases of one, two, or three particles near...