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Keywords: electroplating additives
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021008.
Paper No: EP-24-1086
Published Online: February 4, 2025
...-workers [ 22 ] utilized electroplating bonding technology to bond copper dam base-plates to direct plated copper ceramic substrates, simultaneously conducting orthogonal experiments to study the effects of different types of electroplating additives on bonding rate and strength, and optimizing the process...
