...Michael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these devices has been observed...

... ed. , Wiley , New York , p. 787 . Hertzberg , R. W. , 1996 , Deformation and Fracture Mechanics of Engineering Materials , Wiley , New York , p. 287 . 21 09 2007 22 04 2008 11 02 2009 cooling electronics packaging failure (mechanical) finite element...

.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...

... 2003 01 January 2004 08 07 2004 solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging...

... alloys lead alloys fatigue viscoplasticity creep irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 01 June 2001 01 October 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...

... printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry...

... thermal stresses soldering eutectic alloys tin alloys bismuth alloys lead alloys silver alloys failure (mechanical) packaging 30 June 1999 03 September 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...