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Keywords: flip chip reliability
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Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
https://doi.org/10.1115/1.4053889
Published Online: March 8, 2022
... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...
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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability
Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
https://doi.org/10.1115/1.4051468
Published Online: September 15, 2021
.... The improvement of flip chip reliability by using thermal interface materials was studied. First, a three-dimensional finite element model of the flip chip packaging system and the finite element simulation of electric-thermal-force multifield coupling were conducted. Then, the Joule heating, temperature...
View Articletitled, Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density