...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...

... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

... of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13 ° C utilizing a multidimensional configured thermoelectric will be presented. 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit...

... packaging technologies in electronic systems, and related engineering analysis techniques for design and reliability engineering applications. The book consists of four parts (1 to 4) with a total of 15 chapters. integrated circuit design integrated circuit packaging integrated circuit reliability...

...-chip devices integrated circuit reliability shrinkage thermal expansion 2010 American Society of Mechanical Engineers ...

... creep is presented by Syed ( 9 ). Despite the success of Darveaux’s approach on solder joint reliability, the Coffin–Manson model has also been appreciated by some research groups in WCSP solder joint reliability study ( 10 11 ). finite element analysis integrated circuit reliability solders...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...

... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...

... integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical treatment power cycling accelerated thermal cycling Moiré interferometry flip chip PBGA CBGA finite element analysis computational fluid dynamics...

... ), a technique sometimes called picosecond ultrasonics. Experimental PPPT obtained on Si/SiGe superlattice structure covered by the 100 nm Al film 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase...

... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...

... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...

... packaging integrated circuit interconnections integrated circuit reliability printed circuits In prior generations of automotive electronics based on surface mount technology and laminated substrates, packaging of microprocessor and application-specific integrated circuit (ASIC) chips...

... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability The primary drivers in the electronics industry can be summarized as higher frequency, lower cost, more...

... bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity 03 August 2003 13 June 2004 03 06 2005 Contributed by the Electronic and Photonic...

... received November 15, 2004. Review conducted by: Y. C. Chan. Packaging. 01 October 2003 06 January 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability...

...-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion While flip chip has emerged as an attractive chip packaging methodology because of low cost, high interconnect density, low...