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Keywords: parallel plate effect
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021004.
Paper No: EP-24-1071
Published Online: December 20, 2024
... at high frequencies, as well as the parallel plate effect between multilayer ground planes. A more accurate calculation method of via-plate capacitance is proposed based on the quasi-static method. According to the feature selective verification (FSV) method, the TCV S parameters calculated...
