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Journal Articles

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

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W. Escher, T. Brunschwiler, B. Michel, D. Poulikakos
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2010, 132(8): 081402.
https://doi.org/10.1115/1.4001306
Published Online: June 2, 2010
...W. Escher; T. Brunschwiler; B. Michel; D. Poulikakos We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed with liquid coolant by an overlying two-dimensional...
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Topics: Flow (Dynamics), Fluids, Heat sinks, Heat transfer, Manifolds, Microchannels, Temperature, Thermal resistance, Design, Vehicles