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Journal Articles

Design of Experiments Informed Investigation of Magnetic Field-Assisted Nickel Electroplating on Copper

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Abishek Balsamy Kamaraj, Saketh Merugu, Chaitanya Mahajan, Anju Gupta
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano Sci. Eng. June 2025, 13(2): 024501.
Paper No: JMNM-24-1039
https://doi.org/10.1115/1.4067792
Published Online: March 11, 2025
View Articletitled, Design of Experiments Informed Investigation of Magnetic Field-Assisted Nickel Electroplating on Copper
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Topics: Copper, Electrodeposition, Electroplating, Experimental design, Magnetic fields, Nickel, Surface roughness, Electrolytes, Flow (Dynamics), Current density
Journal Articles

Infrared Emission for Heat Radiation From Micro-Cone Textured Metallic Sheet Device With Semi-Regular Alignment

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Tatsuhiko Aizawa, Hiroki Nakata, Takeshi Nasu
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. June 2023, 11(2): 021003.
Paper No: JMNM-23-1061
https://doi.org/10.1115/1.4065684
Published Online: June 20, 2024
View Articletitled, Infrared Emission for Heat Radiation From Micro-Cone Textured Metallic Sheet Device With Semi-Regular Alignment
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Topics: Emissions, Thermal radiation, Vacuum, Heat flux, Wavelength, Texture (Materials), Temperature, Copper, Size effect
Journal Articles

Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process

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Obehi G. Dibua, Farzana Tasnim, Aaron Liao, Joshua Grose, Dipankar Behera, Chee S. Foong, Michael Cullinan
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Micro Nano Sci. Eng. March 2023, 11(1): 011004.
Paper No: JMNM-23-1021
https://doi.org/10.1115/1.4064389
Published Online: January 24, 2024
View Articletitled, Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process
Open the PDF for Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process in another window
Topics: Copper, Electrical resistivity, Lasers, Nanoparticles, Particulate matter, Simulation, Sintering, Furnaces, Microscale devices
Journal Articles

Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating

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Semih Akin, Jung-Ting Tsai, Min Soo Park, Young Hun Jeong, Martin Byung-Guk Jun
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. December 2020, 8(4): 041014.
Paper No: JMNM-20-1034
https://doi.org/10.1115/1.4049578
Published Online: February 12, 2021
View Articletitled, Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating
Open the PDF for Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating in another window
Topics: Adhesion, Copper, Electroless plating, Manufacturing, Polymers, Pressure, Sprays, Plating, Coatings
Journal Articles

Pulsed Laser-Based Hybrid Microscribing of Cu and Al in Salt Solution

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Sooraj Shiby, Nammi Srinagalakshmi, Nilesh J. Vasa, Shigeki Matsuo, Muralidhar Miryala
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2020, 8(3): 031002.
Paper No: JMNM-19-1081
https://doi.org/10.1115/1.4046854
Published Online: April 30, 2020
View Articletitled, Pulsed Laser-Based Hybrid Microscribing of Cu and Al in Salt Solution
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Topics: Copper, Lasers, Microchannels, Water, Fluence (Radiation measurement), Temperature, Aluminum, Surface roughness, Machining
Journal Articles

Dual Regime Spray Deposition Based Laser Direct Writing of Metal Patterns on Polymer Substrates

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Semih Akin, Ted Gabor, Seunghwan Jo, Hangeun Joe, Jung-Ting Tsai, Yeonsoo Park, Chi Hwan Lee, Min Soo Park, Martin Byung-Guk Jun
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2020, 8(2): 024511.
Paper No: JMNM-19-1074
https://doi.org/10.1115/1.4046282
Published Online: March 27, 2020
View Articletitled, Dual Regime Spray Deposition Based Laser Direct Writing of Metal Patterns on Polymer Substrates
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Topics: Copper, Lasers, Metals, Polymers, Sprays, Adhesion, Spraying (Coating processes)
Journal Articles

Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS ® Technology

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Hagen Mueller, Tobias Groezinger, Sascha Weser, Wolfgang Eberhardt, André Zimmermann
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. March 2018, 6(1): 011004.
Paper No: JMNM-17-1041
https://doi.org/10.1115/1.4038320
Published Online: December 14, 2017
View Articletitled, Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS ® Technology
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Topics: Fatigue strength, Metals, Nickel, Stress, Surface roughness, Lasers, Copper
Journal Articles

Achieving Ultra-Omniphilic Wettability on Copper Using a Facile, Scalable, Tuned Bulk Micromanufacturing Approach

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Nicholas Clegg, Krishna Kota, Xin He, Sean Ross
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2017, 5(3): 031003.
Paper No: JMNM-16-1041
https://doi.org/10.1115/1.4036446
Published Online: May 17, 2017
View Articletitled, Achieving Ultra-Omniphilic Wettability on Copper Using a Facile, Scalable, Tuned Bulk Micromanufacturing Approach
Open the PDF for Achieving Ultra-Omniphilic Wettability on Copper Using a Facile, Scalable, Tuned Bulk Micromanufacturing Approach in another window
Topics: Copper, Water, Micromanufacturing, Surface roughness, Drops, Etching, Coatings, Polishing
Journal Articles

Tool/Chip Interfacial Friction Analysis in Atomistic Machining of Polycrystalline Coppers

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Jing Shi, Chunhui Ji, Yachao Wang, Steve Hsueh-Ming Wang
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. December 2014, 2(4): 041001.
Paper No: JMNM-14-1032
https://doi.org/10.1115/1.4028025
Published Online: July 29, 2014
View Articletitled, Tool/Chip Interfacial Friction Analysis in Atomistic Machining of Polycrystalline Coppers
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Topics: Cutting, Friction, Machining, Copper, Grain size
Journal Articles

An Experimental Investigation on the Fabrication of Micro/Meso Surface Features by Metallic Roll-to-Plate Imprinting Process

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Zhaoyang Gao, Linfa Peng, Peiyun Yi, Xinmin Lai
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2013, 1(3): 031004.
Paper No: JMNM-12-1074
https://doi.org/10.1115/1.4024985
Published Online: August 13, 2013
View Articletitled, An Experimental Investigation on the Fabrication of Micro/Meso Surface Features by Metallic Roll-to-Plate Imprinting Process
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Topics: Aluminum, Cavities, Copper, Dimensions, Grain size, Manufacturing, Stress, Mechanical properties