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Journal Articles

Design of Experiments Informed Investigation of Magnetic Field-Assisted Nickel Electroplating on Copper

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Abishek Balsamy Kamaraj, Saketh Merugu, Chaitanya Mahajan, Anju Gupta
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano Sci. Eng. June 2025, 13(2): 024501.
Paper No: JMNM-24-1039
https://doi.org/10.1115/1.4067792
Published Online: March 11, 2025
View Articletitled, Design of Experiments Informed Investigation of Magnetic Field-Assisted Nickel Electroplating on Copper
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Topics: Copper, Electrodeposition, Electroplating, Experimental design, Magnetic fields, Nickel, Surface roughness, Electrolytes, Flow (Dynamics), Current density
Journal Articles

Effects of Antimony Deposition on Field-Emission Current Density of Ge/Si

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Veronika Burobina
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. June 2021, 9(2): 021001.
Paper No: JMNM-20-1060
https://doi.org/10.1115/1.4050208
Published Online: March 15, 2021
View Articletitled, Effects of Antimony Deposition on Field-Emission Current Density of Ge/Si
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Topics: Current density, Density, Electron field emission, Emissions, Scanning tunneling microscopy, Wetting
Journal Articles

Experimental Investigation of Tensile Properties of SS316L and Fabrication of Micro/Mesochannel Features by Electrical-Assisted Embossing Process

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Linfa Peng, Jianming Mai, Tianhao Jiang, Xinmin Lai, Zhongqin Lin
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. June 2014, 2(2): 021002.
Paper No: JMNM-13-1051
https://doi.org/10.1115/1.4026884
Published Online: March 24, 2014
View Articletitled, Experimental Investigation of Tensile Properties of SS316L and Fabrication of Micro/Mesochannel Features by Electrical-Assisted Embossing Process
Open the PDF for Experimental Investigation of Tensile Properties of SS316L and Fabrication of Micro/Mesochannel Features by Electrical-Assisted Embossing Process in another window
Topics: Current density, Electric current, Embossing, Flow (Dynamics), Grain size, Stress, Deformation, Temperature, Manufacturing, Work hardening