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P. S. Lee
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Proceedings Papers
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 155-167, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0730
Proceedings Papers
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0814
Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0500
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2013, 135(4): 041901.
Paper No: HT-11-1177
Published Online: March 20, 2013
Journal Articles
Publisher: ASME
Article Type: Heat Transfer Enhancement
J. Heat Mass Transfer. October 2012, 134(10): 101901.
Published Online: August 7, 2012
Proceedings Papers
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 719-725, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88585
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 485-497, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39636
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 74–81.
Published Online: April 30, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 328–334.
Published Online: January 28, 2000
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
Published Online: December 1, 1999
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
Published Online: March 1, 1998
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 12–17.
Published Online: March 1, 1998
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 268–274.
Published Online: December 1, 1997
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 218–227.
Published Online: December 1, 1997
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 142–147.
Published Online: September 1, 1996
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 114–121.
Published Online: September 1, 1996
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 433–439.
Published Online: December 1, 1993
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 219–222.
Published Online: September 1, 1990